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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 19 tsz02201-0p5p0bk00810-1-2 ? 2014 rohm co., ltd. all rights reserved. 04.dec.2014 rev.001 tsz22111 ? 14 ? 001 www.rohm.com system motor driver for cd/dvd player 5ch system motor driver for car av BD8205EFV-M general description BD8205EFV-M is a 5-channel system motor driver developed for dc motors (spindle motor, sled motor, loading motor) and coils (tracking, focus) drive for actuator. this ic can drive the motor and the coil of a cd /dvd drive. features 5ch btl driver powvcc1 for ch s 1, 2, and 3 (dc motors) and powvcc2 for ch s 4 and 5 (actuator) are independent for efficient drive configuration. built-in protection functions (tsd, uvlo, bias drop mute) aec -q100 qualified application car audio key specifications driver power supply voltage range powvcc1 6v to 10v powvcc2 4.3v tov pow vcc1 operating temperature range - 40 c to + 85 c output offset (chs 1,2,3) 100mv (max) output offset (chs 4,5) 50mv (max) maximum output range (all chs) 6v (typ) package w(typ) d(typ) h(max) htssop-b24 7.80 mm 7.60mm 1.00mm htssop-b24 typical application circuit BD8205EFV-M spindle sled loading tracking focus dsp vo5p vo5m vo4p vo4m vo3p vo3m vo2p vo2m vo1p vo1m vreg bias in5 in4 in3 in2 in1 mute1245 powvcc1 powvcc2 powgnd1 powgnd2 pregnd mute3 m m m figure 1. typical application circuit downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 2/ 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M pin configuration pin descriptions (top view) 1 powgnd1 powvcc1 24 2 vo1m in1 23 3 vo1p in2 22 4 vo2m in3 21 5 vo2p in4 20 6 vo3m in5 19 7 vo3p bias 18 8 vo4m mute3 17 9 vo4p pregnd 16 10 vo5m mute1245 15 11 vo5p vreg 14 12 powgnd2 powvcc2 13 figure 2. pin configuration no. pin name function 1 powgnd1 power gnd1 2 vo1m ch1 driver negative output 3 vo1p ch1 driver positive output 4 vo2m ch2 driver negative output 5 vo2p ch2 driver positive output 6 vo3m ch3 driver negative output 7 vo3p ch3 driver positive output 8 vo4m ch4 driver negative output 9 vo4p ch4 driver positive output 10 vo5m ch5 driver negative output 11 vo5p ch5 driver positive output 12 powgnd2 power gnd2 13 powvcc2 power supply voltage 2 14 vreg power supply for internal logic 15 mute1245 mute control input for ch s 1, 2, 4, 5 16 pregnd pre gnd 17 mute3 mute control input for ch 3 18 bias standard voltage input 19 in5 ch5 input 20 in4 ch4 input 21 in3 ch3 input 22 in2 ch2 input 23 in1 ch1 input 24 powvcc1 power supply voltage 1 block diagram vo5p vo5m vo4p vo4m vo3p vo3m vo2p vo2m vo1p vo1m level shift level shift level shift level shift level shift bias in5 in4 in3 in2 in1 t.s.d. powvcc1 uvlo bias drop mute mute1245 regulator vreg control logic mute3 powvcc1 powvcc2 figure 3. block diagram downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 3/ 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M absolute maximum ratings (ta=25c) parameter symbol rating unit power supply voltage 1 v powvcc1 12 v power supply voltage 2 v powvcc2 v powvcc1 v input pin voltage 1 v in1 (note 1) 12 v input pin voltage 2 v in2 (note 2) 7 v package dissipation pd 1.10 (note 3) w 3.99 (note 4) operating temperature range topr - 40 to +85 c storage temperature range tstg - 55 to +150 c maximum junction temperature tjmax +150 c (note 1 ) this is applicable to pins mute1245 and mute3. (note 2 ) this is applicable to pins in1, in2, in3, in4, in5, and bias. (note 3 ) glass epoxy substrate dimensions are 70mm70mm1.6mm, 1 layer substrate, (copper foil 0mm0mm) reduce power dissipation capability by 8.8mw for each degree above 25c. (note 4) glass epoxy substrate dimensions are 70mm70mm1.6mm, 4 layer substrate, (copper foil 70mm70mm) reduce power dissipation capability by 32.0mw for each degree above 25c. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protect ion measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta = - 40 c to +85 c ) parameter symbol m in t yp m ax unit pre block power supply, dc motor system power supply (note 1) v powvcc1 6 8 10 v actuator system power supply (note 1) v powvcc2 4.3 8 v powvcc1 v (note 1 ) please decide the power supply voltage after considering power dissipation. downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 4/ 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M electrical characteristics (unless otherwise noted ta=25 c , v pow vcc 1 =v pow vcc2 =8 v, v bias =1.65v, r l =8 ) parameter symbol limit unit condition m in t yp m ax quiescent current i q 13 30 ma at no-load, v mute1245,3 =h < driver > output offset (chs 1, 2, 3) v oof1 23 - 100 0 100 mv output offset (chs 4, 5) v oof 45 - 50 0 50 mv maximum output range (chs 1, 2, 3, 4, 5) v om 5.3 6.0 v total ron=2.5 (typ) equivalent closed circuit loop gain (chs 1, 2, 3) g v1 23 24.0 25.7 27.4 db closed circuit loop gain (chs 4, 5) g v 45 15.5 17.5 19.5 db input impedance (chs 1, 2, 3) r in123 13 20 27 k input impedance (chs 4, 5) r in45 30 47 64 k < others > mute1245,3 low level voltage v ml 0.5 v mute1245,3 high level voltage v mh 2.0 v mute1245,3 input current i mute 32 52 74 a v mute1245,3 =3.3v bias drop mute v bias 0.5 0.7 0.9 v bias input current i bias 32 52 74 a v bias =1.65v uvlo detection voltage v uvlod 3.4 3.8 4.2 v uvlo release voltage v uvlor 3.6 4.0 4.4 v vreg voltage v vreg 5 .0 v c vreg =0.1 f downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 5/ 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M electrical characteristics (unless otherwise noted ta=- 40 c to 85 c , v pow vcc 1 =v pow vcc2 =8 v, v bias =1.65v, r l =8 ) parameter symbol limit unit condition m in t yp m ax quiescent current i q 13 33 ma at no-load, v mute1245,3 =h < driver > output offset (chs 1, 2, 3) v oof1 23 - 100 0 100 mv output offset (chs 4, 5) v oof 45 - 50 0 50 mv maximum output range (chs 1, 2, 3, 4, 5) v om 4.8 6.0 v total ron=2.5 (typ) equivalent closed circuit loop gain (chs 1, 2, 3) g v1 23 24.0 25.7 27.4 db closed circuit loop gain (chs 4, 5) g v 45 15.5 17.5 19.5 db input impedance (chs 1, 2, 3) r in123 10 20 28 k input impedance (chs 4, 5) r in45 28 47 66 k < others > mute1245,3 low level voltage v ml 0. 4 v mute1245,3 high level voltage v mh 2.0 v mute1245,3 input current i mute 22 52 108 a v mute1245,3 =3.3v bias drop mute v bias 0. 3 0.7 1.1 v bias input current i bias 22 52 108 a v bias =1.65v uvlo detection voltage v uvlo 3.4 3.8 4.2 v uvlo release voltage v uvlor 3.6 4.0 4.4 v vreg voltage v vreg 5 .0 v c vreg =0.1 f downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 6/ 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M typical performance curves figure 4. quiescent current :i q figure 5. ch1 closed circuit loop gain: g v1 23 figure 6. ch2 closed circuit loop gain: g v1 23 figure 7. ch3 closed circuit loop gain: g v1 23 5 10 15 20 25 30 1 3 5 7 9 11 13 ic current:i q [ma] supply voltage :v powvcc1,2 [v] 24 25 26 27 28 -50 -25 0 25 50 75 100 ch1 gain : g v123 [db] ta [ ] 24 25 26 27 28 -50 -25 0 25 50 75 100 ch2 gain : g v123 [db] ta[ ] 24 25 26 27 28 -50 -25 0 25 50 75 100 ch3 gain : g v123 [db] ta [ ] v powvcc1 ,2 =4.5v to 10v v mute3 =v mute1245 =3.3v v bias =1.65v ta=25 v powvcc1 ,2 = 8v v mute3 =v mute1245 =3.3v v bias =1.65v v in1 =v bias +0.1v ta=- 40 to 85 v powvcc1 ,2 = 8v v mute3 =v mute1245 =3.3v v bias =1.65v v in 2 =v bias +0.1v ta=- 40 to 85 v powvcc1 ,2 = 8v v mute3 =v mute1245 =3.3v v bias =1.65v v in 3 =v bias +0.1v ta=- 40 to 85 downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 7/ 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M typical performance curves figure 8. ch4 closed circuit loop gain: g v 45 figure 9. ch5 closed circuit loop gain: g v 45 figure 10. vreg voltage :v vreg 15 16 17 18 19 20 -50 -25 0 25 50 75 100 ch4 gain : g v45 [db] ta [ ] 15 16 17 18 19 20 -50 -25 0 25 50 75 100 ch5 gain : g v45 [db] ta [ ] 3.5 4.0 4.5 5.0 5.5 6.0 6.5 -50 -25 0 25 50 75 100 output voltage v vreg [v] ta [ ] v powvcc1 ,2 = 8v v mute3 =v mute1245 =3.3v v bias =1.65v v in 4 =v bias +0.1v ta=- 40 to 85 v powvcc1 ,2 = 8v v mute3 =v mute1245 =3.3v v bias =1.65v v in 5 =v bias +0.1v ta=- 40 to 85 v powvcc1 ,2 = 8v v mute3 =v mute1245 =3.3v v bias =1.65v v in 4 =v bias ta=- 40 to 85 downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 8/ 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M description of block 1. driver control pins mute1245 ( pi n15), mute3 (pin17), bias (pin18) all driver output conditions are controlled by switching the mute1245 and mute3 pin s to high and low levels. shown below is the input -output logic table including bias drop mute. driver logic (normal operation) state no. input output (note 1) (note 2) mute1245 mute3 bias ch1 (sp) ch2 (sl) ch3 (ld) ch4 (fc) ch5 (tk) 1 h h h active active active active active 2 h l h active active mute active active 3 l h h mute mute active mute mute 4 l l h mute mute mute mute mute 5 h h l mute mute mute mute mute 6 h l l mute mute mute mute mute 7 l h l mute mute mute mute mute 8 l l l hi -z hi -z hi -z hi -z hi -z driver logic (uvlo, tsd protected operation) state no. input output (note 1) (note 2) mute1245 mute3 bias ch1 (sp) ch2 (sl) ch3 (ld) ch4 (fc) ch5 (tk) 9 l l l hi -z hi -z hi -z hi -z hi -z 10 others mute mute mute mute mute (note 1) mute : both positive and negative output voltages pull-up to p ow vcc/2(=v ref ). (note 2) hi - z : both positive and negative outputs become hi- z. 2. bias drop mute if bias pin voltage becomes 0.7v (typ) or less, output of all channels turns off. please set it to a minimum of 1.2v for typical use. 3. p ow vcc1 drop mute (uvlo) if p ow vcc1 pin voltage becomes 3.8v (typ) or less, output of all channels turns off. if p ow vcc1 pin voltage becomes 4.0v (typ) or more, output of all channels turns on. 4. thermal shutdown circuit (tsd) thermal shutdown circuit is designed to turn off all output channels when the junction temperature (tj) reaches 175c (typ). ic operation begins again when the junction temperature decreases to 150c (typ) or less. 5. vreg voltage (pin14) vre g pin is the regulator output for internal blocks. 5v (typ) is generated on this pin using p ow vcc1 power supply . connect a capacitor c vreg = 0.1f (typ) to the vreg pin for phase compensation. operation may become unstable if c vreg is not connected. vreg is not design ed as the power supply for other parts. therefore connect only a capacitor to vreg pin. downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 9/ 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M 6 . output amplitude calculation i) spindle,sled,loading m v ref vop=v ref + 96.4k r in +20k x1x2x(v in -v bias ) r1=20k level shift 2 2 bias input v bias v in r in r2=96.4k vop vom in vo=(vo+) - (vo-) it is 4 between the output a* vop=v ref - 96.4k r in +20k x1x2x(v in -v bias ) 96.4k r in +20k ???? = .4k ? ?? + 20 k [db] example: r in =0. ???? = .4k 20 k = . [db] ii ) focus,tracking m v ref r1=47k level shift 2 2 bias input v bias v in r in r2=86.2k vop vom in 86.2k r in +47k vo=(vo+) - (vo-) it is 4 between the output b* vop=v ref + 86.2k r in +47k x1.02x2x(v in -v bias ) vop=v ref - 86.2k r in +47k x1.02x2x(v in -v bias ) ???? = .2k ? ?? + 4 k . [db] example: r in =0. ???? = .2k 4 k . = . [db] figure 11. spindle, sled, loading closed loop gain calcu la tion figure 12. focus, tracking closed loop gain calcu la tion please consider component dispersion r = k % r = . k % r / r = . . % ? a = % please consider component dispersion r = k % r = . k % r / r = . . % ? b = . % downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 10 / 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M timing chart 1. kind of the signals ? external power supply p ow vcc1 , powvcc2 ? internal power supply vreg ? reference voltage input bias ? driver input in1, in2, in3, in4, in5 ? mute control input mute1245, mute3 ? driver output vo1p, vo1m, vo2p, vo2m, vo3p, vo3m, vo4p, vo4m, vo5p, vo5m, 2 . start- up sequence (1) input external power supply. the slew rate recommends less than 0.045v/s in the start- up before the power supply voltage arrive at 5v. when the power supply voltage quickly start- up , an overshoot of the vreg voltage occurs and may lead to internal element destruction. keep relations of powvcc1 >= powvcc2 at the start- up. (2) input reference voltage (bias). because bias is sequence-free, bias input before the external power supply at start- up is possible. (3) after the powvcc1 power supply voltage arrived at 4.0v (uvlo release voltage), input the mute control. (4) after input the mute control, input any voltage into each driver input. 0v powvcc1, powvcc2 : 8v vreg : 5v(typ) pin voltage bias mute1245, 3 driver output 1.65v 0v 3.3v off active time 0v uvlo release 4.0v(typ) input mute after uvlo and bias drop mute release bias drop mute release 0.7v(typ) slew rate 0.045v/ s or more slowly equal to bias or hi-z input input any voltage driver input figure 13 . example of start- up sequence downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 11 / 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M 3 . shut-down sequence (1) turn off the driver input and the mute control input. (2) turn off the reference voltage input (bias). because bias is sequence-free, turn off after the power supp ly turn off is possible. (3) the slew rate recommends more than - 0.045v/s in the shut-down after the power supply voltage lower than 5v. when the power supply voltage quickly shut-down, the discharge current from c vreg becomes the overcurrent and may lead to internal element destruction. keep relations of powvcc1 >= powvcc2 at the shut-down also. 0v powvcc1, powvcc2 : 8v vreg : 5v(typ) pin voltage bias mute1245, 3 driver output 1.65v 0v 3.3v off active time 0v uvlo detect 3.8v(typ) turn off mute before uvlo and bias drop mute detect bias drop mute detect 0.7v(typ) slew rate -0.045v/ s or more slowly equal to bias or hi-z input input any voltage driver input figure 14 . example of shut-down sequence downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 12 / 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M application example powgnd1 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 vo1m vo1p vo2m vo2p vo3m vo3p vo4m vo4p vo5m vo5p powgnd2 powvcc1 in1 in2 in3 in4 in5 bias mute3 pregnd mute1245 vreg powvcc2 thermal pad powergnd powergnd m m m powergnd powergnd powergnd pregnd pregnd c vreg c pvcc21 c pvcc22 c pvcc12 c pvcc11 spindle motor sled motor loading motor tracking coil focus coil spindle input sled input loading input tracking input focus input bias mute mute fi gure 15 . application example channel setting example ch1 spindle ch2 sled ch3 loading ch4 tracking ch5 focus external parts list component name component value product name manufacturer c pvcc11 0.1 f gcm188 r1 1h104ka 42 mu r at a c pvcc12 47 f ucd1e470mcl nichicon c pvcc21 0.1 f gcm188 r1 1h104ka 42 mu r at a c pvcc22 47 f ucd1e470mcl nichicon c vreg 0.1 f gcm188 r1 1h104ka 42 mu r at a downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 13 / 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M power dissipation figure 16. power dissipation ? power dissipation calculated when ic is mounted on a 70mm 70mm 1.6mm glass epoxy substrate. (power dissipation changes with the copper foil density of the board.) ? the board and the ics bottom thermal plate are solder-connected. board (1): 1-layer board (copper foil 0mm 0mm) board (2): 2-layer board (copper foil 15mm 15mm) board (3): 2-layer board (copper foil 70mm 70mm) board (4): 4-layer board (copper foil 70mm 70mm) boar d (1): ja = 113.6 c/w board (2): ja = 73.5 c/w board (3): ja = 44.6 c/w board (4): ja = 31.3 c/w at ta=85c: board (1): pd = 0.57w board (2): pd = 0.88w board (3): pd = 1.45w board (4): pd = 2.07w (3) 2.80w (2) 1.70w (1) 1.10w (4) 3.99w downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 14 / 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M i/o equivalence circuits 2.vo1m, 3.vo1p, 4.vo2m, 5.vo2p, 6.vo3m, 7.vo3p 8.vo4m, 9.vo4p, 10.vo5m, 11vo5p 2k 50k 50k 96k 5p pin1 pin16 pin24 pin14 pin2, 3, 4, 5, 6, 7 2k 50k 50k 86k 5p pin1 2 pin16 pin13 pin14 pin8, 9, 10, 11 14.vreg 15.mute1245, 17.mute3 pin16 pin16 pin1 pin1 pin14 312 k 100 k 10k pin16 pin16 pin15, 1 7 50 k 50 k pin16 pin16 18.bias 19.in5, 20.in4 pin16 pin16 pin1 8 20 k 50 k pin16 3 2 50 k 47 k pin16 20k pin21, 22, 23 21.in3, 22.in2, 23.in1 pin16 47k pin19, 20 values is typical. downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 15 / 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M operational notes 1. reverse connection of power s upply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarit y when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient conditi on. however, pins that drive inductive loads (e.g. motor driver outputs, dc-dc converter outputs) may inevitably go below ground due to back emf or electromotive force. in such cases, the user should make sure that such voltages going below ground will not cause the ic and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and pcb wiring to name a few. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separatel y but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating (pd) be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. to prevent exceeding the power dissipation rating , increase the board size and copper area. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagneti c field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 16 / 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M operational notes C continued 11. unused input pins input pin s of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. unless otherwise specified, unused input pin s should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutua l interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 17. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of sa fe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to the ic. normal operation should alwa ys be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from hea t damage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 17 / 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M ordering information b d 8 2 0 5 e f v - m e 2 part number package efv : htssop-b24 packaging and forming specification m : high reliability e2 : embossed tape and reel (htssop-b24) marking diagram htssop-b24 (top view) d 8 2 0 5 e f v part number marking lot number 1pin mark downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 18 / 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M physical dimension, tape and reel information package name htssop-b24 downloaded from: http:///
www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 19 / 19 tsz02201-0p5p0bk00810-1-2 04.dec.2014 rev.001 BD8205EFV-M revision history date revision changes 04.dec.2014 001 new release downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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